Flagship A733: 2×A76+6×A55 @2.0GHz, 3 TOPS NPU, LPDDR5 + UFS, 8K decode, -40~75℃
Full-featured A733 kit: open baseboard I/O, debug tools, manuals and sources
A537 octa big.LITTLE (2×A73+6×A53), 2K dual-display, pin-compatible tiering with A333
A537 EVK for fast validation of Android apps and peripherals
Octa A55 1.8/2.0GHz, 4K@60 decode, G57 GPU, multi-display
Penta-core A73+A53, 1080P@60 multi-display (MIPI/LVDS/RGB/eDP), pin-compatible with A537
Quad-core A53 entry platform, 4K@30 decode, compact 144-pin, ideal for cost-driven builds
2×A76 + 6×A55 @2.0GHz, 3 TOPS NPU, LPDDR5 + UFS, dual GbE, -40~85℃
4×A7 + RISC-V RT core, 3×GbE + 2×CAN-FD — for PLC, power and gateways
Octa A55 1.8GHz + 2 TOPS NPU, dual GbE + 2×CAN, eDP/HDMI/MIPI, -40~85℃
Quad A53 1.4GHz, HDMI 2.0 4K@60 + dual LVDS, GbE+100M MAC, -30~85℃
Dual A7 + RISC-V + HiFi4 DSP, 40×30mm compact, dual LVDS + MIPI, -40~85℃
T113-i EVK with optional 7" LVDS LCD, dual Ethernet + audio, quick start
1200×1920 IPS with CTP, fits A/T-series EVKs; 4.3~10.1" sizes customizable
1280×800 or 1200×1920, with adapter board and cables, stable volume supply
OV13850 sensor with FPC cable and USB adapter board, direct MIPI-CSI attach
OV5648 5MP and OV8858 8MP FPC cameras, slim profile for handhelds and embedded
Quectel Cat.4 LTE on Mini PCIe, mainstream global bands, software-supported across EVKs
Quectel EC20 CE-HDLG, Cat.4 LTE + GNSS, the default 4G option across our boards
带 * 号温度为可选宽温版本；详细参数以各产品页规格书为准。
| 参数 | A733 | A537 | A523 | A133 | A333 |
|---|---|---|---|---|---|
| CPU | 2×A76+6×A55 2.0G | 2×A73+6×A53 | 8×A55 1.8/2.0G | 4×A53 1.6G | 1×A73+4×A53 1.8G |
| NPU | 3 TOPS | — | — | — | — |
| 内存 | LPDDR5 ≤16GB | LPDDR4 ≤16GB | LPDDR4 2~4GB | LPDDR4 ≤4GB | LPDDR4 ≤8GB |
| 视频 | 8K@24 解码 | 1080P@60 硬解 | 4K@60 H.265 | 4K@30 解码 | 1080P@60 |
| 显示 | MIPI/LVDS/RGB | 2K 双显 | MIPI×2/LVDS×2/eDP | MIPI/LVDS/RGB | MIPI/LVDS/RGB/eDP |
| 系统 | Android 15 / Ubuntu 24.04 | Android 13/15 | Android 13 / Ubuntu | Android 10 / Ubuntu | Android 15 / Ubuntu 22.04 |
| 温度 | -40~75℃ | -25~65℃ | -25~75℃ | -10~70℃ | -20~70℃ |
| 封装 | 54×38mm 188PIN | 60×40mm 188PIN | 60×40mm 188PIN | 54×38mm 144PIN | 60×40mm 188PIN |
| 定位 | 旗舰 AI / 8K | 中高端 2K 双显 | 高清交互 4K | 入门低成本 | 普惠多屏 |
| 参数 | T736 | T527 | T507 | T153 | T113-i |
|---|---|---|---|---|---|
| CPU | 2×A76+6×A55 2.0G | 8×A55 1.8GHz | 4×A53 1.4G | 4×A7 1.6GHz | 2×A7 1.2GHz |
| 协处理 | — | — | — | RISC-V E907 600M | RISC-V + HiFi4 DSP |
| NPU | 3 TOPS | 2 TOPS | — | — | — |
| 内存 | LPDDR5 ≤16GB | LPDDR4 2~4GB | LPDDR4 1~4GB | DDR3/DDR4 ≤1GB | DDR3 512MB |
| 网络 | 双千兆 | 2×千兆 | 千兆+百兆 MAC | 3×千兆 | 千兆 EMAC |
| CAN | — | 2×CAN | — | 2×CAN-FD | — |
| 温度 | -40~85℃ | -40~85℃ | -30~85℃ | -40~85℃ | -40~85℃ |
| 系统 | Android 13 / Ubuntu 24.04 | Android 13 / Ubuntu 22.04 | Android 10 / Ubuntu | Linux + Qt/LVGL | Ubuntu + Qt5 |
| 封装 | 60×40mm 188+34PIN | 60×40mm 188+84PIN | 60×40mm 158PIN | 40×40mm 148PIN | 40×30mm 128PIN |
| 定位 | 边缘 AI / 机器人 | 高性能工业 | 经典工业 | PLC / 电力 / 网关 | 迷你低成本 |